Business Opportunities -HTCC, LTCC, DPC, DBC, AMB, forecast for the next three years

The global ceramic substrate market is hot, and the market size is growing steadily.

lN ceramic materials can be used as copper-coated substrate materials, electronic packaging materials, ultra-high temperature device packaging materials, high power device platform materials, high frequency device materials, sensor film materials, optical electronic device materials, coatings and functional enhancement materials. According to relevant research data, the global ceramic substrate market size reached 6.59 billion US dollars in 2021, and it is expected that the global scale will reach 10.96 billion US dollars in 2029, with an average annual growth rate of about 6.57%. According to the different processes of ceramic substrate, the ceramic substrate market can be divided into planar ceramic substrate and multi-layer ceramic substrate market, and further subdivided.

DPC ceramic substrate market is broad. Because of its high circuit accuracy and low preparation temperature, DPC ceramic substrate is widely used in high-precision and small-volume packaging products, and is widely used in high-power light-emitting diodes. According to relevant research data, the global market size of DPC ceramic substrates will reach $1.2 billion in 2020 and is expected to reach $1.7 billion in 2026, with a CAGR of 5.2%. At present, the main manufacturers are Japan Maruwa, Tongxin Electronics, Jiuhao precision and so on.

Power modules drive the market expansion of DBC and AMB ceramic substrates. DBC ceramic substrate has high strength, strong thermal conductivity and stable combination of high-quality performance, and AMB ceramic substrate is developed on the basis of DBC, the combination strength is relatively higher. In recent years, with the rapid development of new energy vehicles and photovoltaic energy storage industry, the demand for IGBT power modules is growing rapidly, and the demand for DBC and AMB ceramic substrates is also increasing. According to Banbang Conductor Network, the market size of DBC ceramic substrate is $289 million in 2020 and is expected to reach $403 million in 2027, with a CAGR of 8.6%. According to relevant forecasts, the AMB ceramic substrate market size is $65 million in 2020 and is expected to reach $306 million in 2027, with a CAGR of 22.7%. At present, the main manufacturers of DBC ceramic substrate are Rogers, Heraeus Group, Kori Chemical, etc.; AMB ceramic substrate main manufacturers are Rogers, Japan Kyocera, Japan Maru and so on.

Rf component packaging drives demand for advanced packaging of multilayer ceramic substrates. Multilayer ceramic substrate mainly includes high temperature co-fired ceramic substrate (HTCC) and low temperature co-fired ceramic substrate (LTCC). HTCC and LTCC technologies have good microwave, thermal conductivity, sealing and mechanical properties, and are widely used in the packaging of radio frequency electronic components, and are widely used in aerospace, satellite communications and civil communications and other fields, so they occupy a large market share. According to relevant forecasts, the global market size of HTCC and LTCC ceramic substrates will reach $2.9 billion in 2021, and will continue to grow steadily at a compound growth rate of 4% in the next few years. At present, the main manufacturers of HTCC and LTCC ceramic substrates are Kyocera, DuPont, Murata Manufacturing Co., LTD.